Technique Capability

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Technique Capability


Linked Electronics can meet all your PCB manufacturing needs from single-sided to complex multi-layered PCB’s and everything in between. Our stringent quality standards are imposed by our trained staff with traceability of PCB’s throughout the production process. Linked Electronics' Management Team has over 15+ years of PCB experience which ensures we get the job done right.

Item Capability Remark
Layer count 2~30 layer  
Lamination FR-4,Aluminum Based,Copper based,High frequency plate,Heavy copper,BT,Rogers,PTFE ect  
Thickness (THK) 0.2mm≤THK≤6.0mm  
Smallest hole (mm) 0.15mm  
Aspect Ratio 13:1  
Max dimension Single or 2-layer 600 x 1000 mm  
Multi-lyr ≤6L 600 x 900 mm  
≥8L 500 x 600 mm  
Gold THK Hard Gold (u") 50u"  
Immersion Gold (u") 4u"  
Copper THK Outer (oz) 6oz  
Inner (oz) 6oz  
Smallest trace width / space (mil) 3/3 mil  
Annual ring Via hole 3mil  
Component hole 6mil  
Copper to edge spacing 0.25mm  
Min trace width / space (mil) Base Copper (oz) Min trace width / space (mil)  
0.5 3/3
1 4/4
2 5/5
3 7/7
5 9/9